HDI capability

Printed Circuit Board
Supplier & Manufacturer

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XG supports 99% of challenging boards




High Density Interconnect board

As electronic components are becoming smaller and more lightweight,yet still demanding better performance, HDI board is becoming the fastest growing section in board manufacture.

HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. They also contain blind and/or buried vias and often contain microvias of .006 or less in diameter.

XG handles HDI board with the most advanced equipments and very well trained engineers.

Type Description Parameters
HDI
3+C+3
support bulk production
4+C+4
prototype small qty only
Buried vias laser drill
support bulk production
Min laser drill hole size
3mil

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