Many friends asked me, what kind of boards do I handle. And what is HDI board stands for ?
I say: Apart from the regular single/ double sided FR4 rigid and flex ones, we also handle those challenging ones.
Again, they may ask, what is the stack up you can do, what’s the top challenging ones you have made
-Well, we support more than you can imagine.
Let’s start with bunches of pictures.
This is a typical stack up for 1+N+1 interconnetions. 1 stand for the lamination that shall take place. Likewise, we can do top to 3+n+3 in bulk production, while support 4+n+4 in prototypes.
Can you do RF high speed/ microwave boards like M4/ M6 ?
-Yes we can, prototypes in 2wks.
Can you do ROGERS hybrid lamination boards?
-Yes, we just delivered that, in 3wks time.
It is because of customers have so many varieties, and technology is keeping evolving rapidly. So that we must handle with more difficult and challenging designs, like blind and buried vias with a high density of interconnections. Also known as HDI boards.
An HDI PCB has a higher circuit density per unit area than a traditional PCB. Knowing Your Dielectric Material’s Properties is very crucial before you build such an important board.
Compared to traditional multilayer PCBs materials, and the following properties are critical:
1.Glass transition temperature (Tg)
2.Decomposition temperature (Td)
3.Coefficient of thermal expansion (CTE) along the Z axis (CTEz)
4.Time to delamination
Generally, the higher the performance, the more costly the material. Here is a chart of common dielectrics comparing the cost to performance, along with typical applications.
If you wish to learn more about HDI boards or other challenging boards, pls contact us any time.
Find us by FB@XGTechnologies or RFQ@xg-technologies.com